Manufacturing Capabilities
State-of-the-art equipment and processes for any PCB requirement, from simple prototypes to complex production.
Standard PCB
Layers1-40 layers
Min Line Width/Space2mil/2mil
Min Drill Size0.1mm (mechanical), 0.075mm (laser)
Board Thickness0.2mm - 6.0mm
Max Board Size600mm × 1100mm
Copper Weight0.5oz - 20oz
Impedance Control±5% (TDR verified)
Surface FinishHASL, ENIG, OSP, Immersion Tin/Silver
HDI PCB
Stackup1+N+1 up to 4+N+4
Microvia Diameter≥0.075mm
Layer-to-Layer Registration±25μm
Min Line Width2mil
Blind/Buried ViasYes
Via-in-PadFilled and capped
Flex & Rigid-Flex
MaterialPolyimide (DuPont, Panasonic)
Layers1-8 (flex), 4-20 (rigid-flex)
Min Bend Radius0.5mm
Thickness0.05mm - 0.5mm (flex section)
CoverlayPolyimide / Solder Mask
StiffenerFR-4, Stainless Steel, Aluminum
Materials
StandardFR-4 (Tg135/150/170/180)
High FrequencyRogers, Taconic, Isola
Metal CoreAluminum, Copper
Halogen FreeAvailable
High CTI>600V
CeramicAl₂O₃, AlN
Quality Control
AOI Inspection
Automated optical inspection on every layer
E-Test
100% electrical testing (flying probe / fixture)
Impedance Testing
TDR coupon verification
Cross-Section Analysis
Microsection for quality validation
X-Ray Inspection
BGA and via fill verification
Ionic Contamination
Cleanliness testing per IPC standards
Have Specific Requirements?
Our engineering team can handle custom specs. Let's discuss your project.