HDI PCB
HDI (High Density Interconnect) PCBs utilize microvia and fine line technology for maximum wiring density. Essential for smartphones, tablets, and wearable devices requiring miniaturization.
Specifications
Layers4-20 layers
Min Line W/S2mil/2mil
Laser Drill0.075mm
Registration±25μm
Stackup1+N+1 to 4+N+4
MaterialFR-4/BT/ABF
Key Features
Microvia diameter ≥0.1mm
Fine line width/space 3/3mil
Laser drilling technology
Any-layer interconnection
High wiring density
Thin board capability
Applications
SmartphonesTabletsWearable devicesDigital camerasLaptopsAutomotive electronics
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