Technology

HDI PCB Manufacturing Process: Microvia and Buried Via Technology Explained

PCB168 Engineering Team·
HDI PCB Manufacturing Process: Microvia and Buried Via Technology Explained

What is HDI PCB?

HDI (High Density Interconnect) PCB is an advanced circuit board that uses microvia, buried via, and fine-line technologies. Compared to traditional PCBs, HDI boards offer higher routing density, smaller form factors, and superior electrical performance.

As electronic products trend toward miniaturization and higher performance, HDI PCBs have become standard in smartphones, tablets, wearables, and other consumer electronics.

Microvia Technology

Microvias are the core technology of HDI PCBs, typically with diameters less than 150μm (6mil).

Laser Drilling Process

  • CO2 Laser: Suitable for dielectric window opening, 100-150μm diameter
  • UV Laser: For finer holes (50-100μm), can drill directly through copper foil
  • Combined Process: CO2 for window opening, UV for refinement

Microvia Types

  • Blind Via: Connects outer layer to inner layer without penetrating the entire board
  • Buried Via: Exists only between inner layers, invisible from outside
  • Through Via: Penetrates all layers of the board
  • Stacked Via: Multiple microvias stacked vertically
  • Staggered Via: Microvias offset from each other

Build-up Manufacturing Process

HDI PCBs are manufactured using build-up technology. Common structures include:

1+N+1 Structure

The most basic HDI structure with one build-up layer on each side of the core. Suitable for smartphones, GPS, and consumer electronics.

2+N+2 Structure

Two build-up layers on each side, providing higher routing density. Used in high-end smartphones and complex IC packaging.

AMIC (Any Layer Interconnect)

All layers can be directly connected through microvias, offering maximum routing density for the most advanced mobile devices.

Design Rules

ParameterStandard HDIAdvanced HDI
Min trace width/space75/75μm50/50μm
Min microvia diameter100μm75μm
Min pad diameter250μm200μm
Layer-to-layer alignment±50μm±25μm
Dielectric thickness60-80μm40-60μm

Applications

  • Smartphones: Mainboards, camera modules
  • Wearables: Smartwatches, health monitors
  • Medical: Implantable devices, diagnostic instruments
  • Aerospace: Satellite communications, navigation
  • Automotive: ADAS, autonomous driving controllers

Conclusion

HDI PCB manufacturing is a comprehensive technology requiring precision equipment and extensive process experience. Choosing a supplier with mature HDI capabilities is key to ensuring product quality.

Contact our engineering team for professional HDI PCB design and manufacturing consultation.

#HDI

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