HDI PCB
HDI (High Density Interconnect) PCBs utilize microvia and fine line technology for maximum wiring density. Essential for smartphones, tablets, and wearable devices requiring miniaturization.
Specifications
Key Features
Applications
What Is an HDI PCB?
HDI (High Density Interconnect) PCBs use laser-drilled microvias, fine lines down to 2mil/2mil and buried/stacked vias to pack far more routing into a smaller area than conventional boards. PCB168 builds HDI on 4-20 layers with 1+N+1 to 4+N+4 stackups, ideal for miniaturized, high pin-count designs.
Microvia, Fine Line and Any-Layer Technology
The core of HDI is the microvia: PCB168 laser-drills vias down to 0.075mm and holds layer registration to ±25µm, enabling stacked and staggered any-layer interconnects. Combined with 2mil fine-line etching, this supports fine-pitch BGAs and dense component placement that standard through-hole boards cannot achieve.
HDI Applications: Smartphones, Wearables and Automotive
HDI is the default choice wherever board area and weight are constrained: smartphones, tablets, wearables, digital cameras and laptops, plus increasingly automotive electronics such as ADAS and infotainment modules. Higher interconnect density also shortens signal paths, improving speed and reducing EMI.
Ordering HDI PCBs and Prototypes from PCB168
As an HDI PCB manufacturer, PCB168 supports online quoting from your Gerber and stackup files, with fine-line etching, laser microvias and FR-4/BT/ABF material options. Prototypes typically ship in 3-5 working days. Send your layer count, minimum line width and via structure for a manufacturability review.
Frequently Asked Questions
What is an HDI PCB?
An HDI (High Density Interconnect) PCB uses microvias and fine lines down to 2mil/2mil to pack more circuitry into a smaller area, ideal for miniaturized devices.
What laser drill and stackup options does PCB168 offer for HDI?
PCB168 offers laser drilling down to 0.075mm with stackups from 1+N+1 to 4+N+4 and layer registration of ±25µm.
Which products need HDI PCBs?
HDI PCBs are used in smartphones, tablets, wearables, digital cameras, laptops and automotive electronics where space and weight are critical.
What line width and microvia size can PCB168 achieve for HDI prototypes?
For HDI prototypes PCB168 reaches 2mil/2mil fine line width/space, laser microvias down to 0.075mm and any-layer interconnection, so high pin-count BGAs and fine-pitch components route cleanly in a compact stackup.
Are you an HDI PCB manufacturer that handles fine-line etching?
Yes. PCB168 is an HDI PCB manufacturer with fine-line etching capability down to 2mil, laser-drilled microvias and 1+N+1 to 4+N+4 stackups on FR-4, BT or ABF materials for smartphone and tablet-grade density.
Can you build any-layer HDI for high-density smartphone boards?
We produce any-layer HDI with stacked and staggered microvias for the highest routing density, suited to smartphones, wearables and other space-constrained designs. Share your layer count and BGA pitch for a manufacturability check.
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