HDI PCB
HDI (High Density Interconnect) PCBs utilize microvia and fine line technology for maximum wiring density. Essential for smartphones, tablets, and wearable devices requiring miniaturization.
| Specification | Capability |
|---|---|
| Layers | 4-20 layers |
| Min Line W/S | 2mil/2mil |
| Laser Drill | 0.075mm |
| Registration | ±25μm |
| Stackup | 1+N+1 to 4+N+4 |
| Material | FR-4/BT/ABF |
Key Features
Applications
What Is an HDI PCB?
HDI (High Density Interconnect) PCBs use laser-drilled microvias, fine lines down to 2mil/2mil and buried/stacked vias to pack far more routing into a smaller area than conventional boards. PCB168 builds HDI on 4-20 layers with 1+N+1 to 4+N+4 stackups, ideal for miniaturized, high pin-count designs.
Microvia, Fine Line and Any-Layer Technology
The core of HDI is the microvia: PCB168 laser-drills vias down to 0.075mm and holds layer registration to ±25µm, enabling stacked and staggered any-layer interconnects. Combined with 2mil fine-line etching, this supports fine-pitch BGAs and dense component placement that standard through-hole boards cannot achieve.
HDI and IC Substrate Technology
At the highest density end, HDI technology extends into IC substrate territory. An IC substrate is the ultra-fine-line carrier that connects a bare semiconductor die to the PCB, and it relies on the same building blocks PCB168 uses for advanced HDI: laser microvias, any-layer interconnection and very fine line width/space. We build HDI IC substrate-class boards on ABF and BT materials with tight registration for flip-chip, BGA and SiP packages, so designers moving from a package substrate to a system HDI board keep consistent routing rules. If your project sits between conventional HDI and an IC substrate, send the line width, via structure and pad pitch and we will confirm the most cost-effective build.
Fine-Line Etching for HDI Circuits
HDI PCB fine line etching is what makes HDI density possible: PCB168 controls line width/space down to 2mil/2mil (50µm) using precise etch compensation and tightly held etch factor, so trace geometry stays consistent from center to board edge. This matters for fine-line HDI circuits routing high pin-count BGAs and controlled-impedance differential pairs, where over-etch narrows traces and shifts impedance. As a fine-line HDI PCB supplier we validate line width, spacing and impedance against your stackup before production, and pair our fine line etching process with laser microvias and any-layer builds so a compact HDI design routes cleanly the first time. When you need HDI PCB fine line etching down to 2mil with controlled impedance, send the stackup and we confirm the etch window before tooling.
HDI Applications: Smartphones, Wearables and Automotive
HDI is the default choice wherever board area and weight are constrained. An HDI PCB for smartphones and other handsets packs high pin-count application processors, RF front-ends and stacked memory into a thin, any-layer build, which is why smartphones, tablets, wearables, digital cameras and laptops all rely on HDI. An HDI PCB for automotive electronics is increasingly common too: ADAS sensor fusion, domain controllers and infotainment modules need dense routing plus automotive-grade reliability, so PCB168 builds HDI PCB for automotive electronics with controlled impedance, thermal management and IATF-aligned process control. Higher interconnect density also shortens signal paths, improving speed and reducing EMI.
HDI PCB for Communication Devices and 5G Modules
An HDI PCB for communication devices fits dense RF, high-speed digital and power-control circuits into compact base-station radios, routers and network modules. For an HDI PCB for 5G modules, laser microvias and short interconnects help route fine-pitch RF transceivers, processors and memory while controlled-impedance differential pairs protect signal integrity. Share the frequency range, stackup, impedance targets and thermal constraints so PCB168 can review via structures and material options before fabrication.
HDI PCB for Automotive Control Units and Domain Controllers
An HDI PCB for automotive control applications has to survive a working environment that consumer boards never see: repeated temperature cycling under the hood, continuous vibration, and years of service without field access. That is why an automotive control HDI build is judged on interconnect robustness rather than density alone. PCB168 builds HDI PCB for automotive control units — body control modules, domain controllers, ADAS sensor-fusion boards, motor and battery-management controllers — using laser microvias down to 0.075mm with layer registration held to ±25µm, so stacked and staggered via columns stay aligned through thermal expansion instead of accumulating offset at the weakest interface. Fine line width/space down to 2mil/2mil lets a high pin-count MCU or SoC escape its BGA field without forcing extra layers, while controlled-impedance differential pairs keep CAN FD, automotive Ethernet and high-speed sensor links inside their impedance window. On 4-20 layers with 1+N+1 to 4+N+4 stackups and FR-4, BT or ABF material options, the same structure can be tuned toward thermal performance or toward signal integrity depending on which constraint dominates your controller. As an automotive HDI PCB supplier we review via structure, aspect ratio and copper distribution against your stackup before tooling, because a via structure that passes electrical test at room temperature can still fail after thermal cycling if it was never checked for it. Send the layer count, minimum line width, via structure and the operating temperature range of the control unit, and we will confirm the build and flag any manufacturability risk before production.
Ordering HDI PCBs and Prototypes from PCB168
As an HDI PCB manufacturer, PCB168 supports online quoting from your Gerber and stackup files, with fine-line etching, laser microvias and FR-4/BT/ABF material options. Our HDI PCB prototype service typically ships prototypes in 3-5 working days so you can validate a smartphone or automotive HDI design before volume. Send your layer count, minimum line width and via structure for a manufacturability review.
Related Technical Articles
HDI PCB Manufacturing Process: Microvia and Buried Via Technology Explained
An in-depth look at HDI high-density interconnect PCB manufacturing, covering microvia, buried via, and laser drilling technologies.
Multi-Layer PCB Stackup Design Guide
A comprehensive guide to multi-layer PCB stackup design principles and practices, covering 4-layer, 6-layer, 8+ layer structures, impedance control, and signal integrity optimization.
HDI PCB Warranty and RMA Scope: The Evidence Window
HDI boards usually fail after assembly, when the board has already been processed. Warranty terms decide which evidence each side must keep and for how long. Here is how to define RMA scope by defect type, time window and board state.
Frequently Asked Questions
What is an HDI PCB?
An HDI (High Density Interconnect) PCB uses microvias and fine lines down to 2mil/2mil to pack more circuitry into a smaller area, ideal for miniaturized devices.
What laser drill and stackup options does PCB168 offer for HDI?
PCB168 offers laser drilling down to 0.075mm with stackups from 1+N+1 to 4+N+4 and layer registration of ±25µm.
Which products need HDI PCBs?
HDI PCBs are used in smartphones, tablets, wearables, digital cameras, laptops and automotive electronics where space and weight are critical.
What line width and microvia size can PCB168 achieve for HDI prototypes?
For HDI prototypes PCB168 reaches 2mil/2mil fine line width/space, laser microvias down to 0.075mm and any-layer interconnection, so high pin-count BGAs and fine-pitch components route cleanly in a compact stackup.
Are you an HDI PCB manufacturer that handles fine-line etching?
Yes. PCB168 is an HDI PCB manufacturer with fine-line etching capability down to 2mil, laser-drilled microvias and 1+N+1 to 4+N+4 stackups on FR-4, BT or ABF materials for smartphone and tablet-grade density.
Can PCB168 build an HDI PCB for automotive control units?
Yes. For automotive control HDI — domain controllers, body control modules, ADAS sensor-fusion and motor/battery-management boards — we use laser microvias to 0.075mm with ±25µm registration and 2mil/2mil fine lines, and we review via structure, aspect ratio and copper distribution against your stackup so the interconnect holds up under temperature cycling and vibration. Send the layer count, via structure and operating temperature range for a manufacturability review.
Can you build any-layer HDI for high-density smartphone boards?
We produce any-layer HDI with stacked and staggered microvias for the highest routing density, suited to smartphones, wearables and other space-constrained designs. Share your layer count and BGA pitch for a manufacturability check.
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