
Flex PCB
Flexible PCBs use polyimide substrates for bendable circuit solutions. Ideal for compact electronics, folding devices, and applications requiring dynamic flexing.
Specifications
Layers1-8 layers
MaterialPolyimide (PI)
Thickness0.05mm - 0.5mm
Min Line W/S3mil/3mil
Bend Radius≥0.5mm
Surface FinishENIG/OSP
Key Features
Polyimide substrate
Single/double-sided and multilayer
Dynamic bend capability
Lightweight and thin
Excellent flexibility
High temperature resistance
Applications
Mobile phonesMedical implantsAutomotive sensorsCamera modulesDrone electronicsWearable tech
Frequently Asked Questions
What material are flex PCBs made from?
Flex PCBs at PCB168 use polyimide (PI) substrate, available in 1-8 layers with thickness from 0.05mm to 0.5mm for bendable, lightweight circuits.
Can flex PCBs handle dynamic bending?
Yes. With a minimum bend radius of ≥0.5mm and flexible polyimide base, they support both static and dynamic flexing applications.
Where are flex PCBs typically used?
Common uses include mobile phones, medical implants, automotive sensors, camera modules, drone electronics and wearable technology.
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