Manufacturing Capabilities
State-of-the-art equipment and processes for any PCB requirement, from simple prototypes to complex production.
| Capability | Specification |
|---|---|
| Layers | 1-40 layers |
| Min Line Width/Space | 2mil/2mil |
| Min Drill Size | 0.1mm (mechanical), 0.075mm (laser) |
| Board Thickness | 0.2mm - 6.0mm |
| Max Board Size | 600mm × 1100mm |
| Copper Weight | 0.5oz - 20oz |
| Impedance Control | ±5% (TDR verified) |
| Surface Finish | HASL, ENIG, OSP, Immersion Tin/Silver |
| Capability | Specification |
|---|---|
| Stackup | 1+N+1 up to 4+N+4 |
| Microvia Diameter | ≥0.075mm |
| Layer-to-Layer Registration | ±25μm |
| Min Line Width | 2mil |
| Blind/Buried Vias | Yes |
| Via-in-Pad | Filled and capped |
| Capability | Specification |
|---|---|
| Material | Polyimide (DuPont, Panasonic) |
| Layers | 1-8 (flex), 4-20 (rigid-flex) |
| Min Bend Radius | 0.5mm |
| Thickness | 0.05mm - 0.5mm (flex section) |
| Coverlay | Polyimide / Solder Mask |
| Stiffener | FR-4, Stainless Steel, Aluminum |
| Capability | Specification |
|---|---|
| Standard | FR-4 (Tg135/150/170/180) |
| High Frequency | Rogers, Taconic, Isola |
| Metal Core | Aluminum, Copper |
| Halogen Free | Available |
| High CTI | >600V |
| Ceramic | Al₂O₃, AlN |
Quality Control
AOI Inspection
Automated optical inspection on every layer
E-Test
100% electrical testing (flying probe / fixture)
Impedance Testing
TDR coupon verification
Cross-Section Analysis
Microsection for quality validation
X-Ray Inspection
BGA and via fill verification
Ionic Contamination
Cleanliness testing per IPC standards
Have Specific Requirements?
Our engineering team can handle custom specs. Let's discuss your project.