Multi-Layer PCB
Multi-layer PCBs support 4-40 layer configurations for complex circuit designs. High-density interconnection with precise impedance control, ideal for communication equipment, servers, and medical devices.
Specifications
Layers4-40 layers
Board Thickness0.4mm - 6.0mm
Min Line W/S3mil/3mil
Min Drill Size0.1mm
Impedance Control±8%
MaterialFR-4/High-Freq
Key Features
4-40 layers available
Precise impedance control
High-density interconnection
Blind/buried via technology
High Tg materials
Excellent signal integrity
Applications
Communication base stationsServer motherboardsNetwork equipmentMedical devicesAerospaceConsumer electronics
Frequently Asked Questions
How many layers can a multi-layer PCB have at PCB168?
PCB168 produces multi-layer PCBs from 4 up to 40 layers, with board thickness of 0.4mm to 6.0mm and impedance control to ±8%.
Do multi-layer PCBs support blind and buried vias?
Yes. Blind and buried via technology is available, enabling higher routing density for complex designs such as servers and communication equipment.
What is the minimum line width and space?
The minimum line width and space is 3mil/3mil, with a minimum drill size of 0.1mm for high-density interconnection.
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