Multi-Layer PCB
Multi-layer PCBs support 4-40 layer configurations for complex circuit designs. High-density interconnection with precise impedance control, ideal for communication equipment, servers, and medical devices.
| Specification | Capability |
|---|---|
| Layers | 4-40 layers |
| Board Thickness | 0.4mm - 6.0mm |
| Min Line W/S | 3mil/3mil |
| Min Drill Size | 0.1mm |
| Impedance Control | ±8% |
| Material | FR-4/High-Freq |
Key Features
Applications
Related Technical Articles
Multi-Layer PCB Stackup Design Guide
A comprehensive guide to multi-layer PCB stackup design principles and practices, covering 4-layer, 6-layer, 8+ layer structures, impedance control, and signal integrity optimization.
HDI PCB Manufacturing Process: Microvia and Buried Via Technology Explained
An in-depth look at HDI high-density interconnect PCB manufacturing, covering microvia, buried via, and laser drilling technologies.
16-Layer Thick Copper PCB: Writing the Board Thickness Tolerance Line | PCB168
Once layer count and copper weight are frozen, finished board thickness becomes a negotiated range, not a number you specify. This guide covers the datum, measurement locations, whether mask and finish count, and out-of-tolerance disposition — in PO-ready wording.
Frequently Asked Questions
How many layers can a multi-layer PCB have at PCB168?
PCB168 produces multi-layer PCBs from 4 up to 40 layers, with board thickness of 0.4mm to 6.0mm and impedance control to ±8%.
Do multi-layer PCBs support blind and buried vias?
Yes. Blind and buried via technology is available, enabling higher routing density for complex designs such as servers and communication equipment.
What is the minimum line width and space?
The minimum line width and space is 3mil/3mil, with a minimum drill size of 0.1mm for high-density interconnection.
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