HDI PCB Quote Package Checklist: Stackup, Microvias and Acceptance Inputs

An HDI PCB quotation can look precise while still being based on an incomplete product definition. If purchasing sends only Gerber files, overall thickness and a quantity, a fabrication engineer must still determine the microvia layer spans, whether vias are stacked or staggered, which holes require filling, how many build-up stages the structure implies, which stackup controls impedance, and what inspection evidence belongs in the delivery. Two suppliers may make different assumptions and return different prices for structures that are not technically equivalent.

The purpose of an HDI quote package is therefore not to attach as many files as possible. It is to create one controlled baseline that design, quality, purchasing and the prospective manufacturer can interpret in the same way. The package should expose open decisions, identify requirements that cannot change, and define where a supplier may propose a manufacturability alternative. For process background, see the HDI PCB manufacturing guide. For the relevant project discussion entry point, use the HDI PCB product page. The checklist below supports RFQ preparation; it does not replace project-specific DFM, qualification or contractual acceptance criteria.

1. Establish one quotation baseline

Start the package with the PCB part number, revision, RFQ date, requested currency and commercial basis, delivery destination, prototype and forecast quantity breaks, and whether the scope covers bare boards only or additional services. Every fabrication attachment should map to that same part number and revision. If Gerber, drill, stackup, mechanical drawing and fabrication notes use different naming systems, add a file index that states the purpose, revision and authority of each item.

“Use the latest files” is not revision control. A timestamp can change when a folder is copied, compressed or forwarded. If an earlier revision remains in the package for comparison, isolate it and mark it as reference only. When a drawing, image and fabrication note disagree, log the conflict rather than asking the estimator to select the most convenient interpretation. The PCB fabrication notes conflict checklist provides a practical way to identify those authority gaps before quotation.

2. Describe every microvia span explicitly

A layer-to-layer via table is one of the most project documents determine revision and applicability.

• IPC-6016, qualification and performance specification framework for HDI structures; contractual use must be stated by the order.
• IPC-2221, generic printed-board design framework.
• IPC-2581, a general manufacturing-description data exchange framework; projects may still use an approved combination of Gerber, ODB++, drill files, drawings and tables.
• Customer-approved electrical constraints, stackup, fabrication drawing, impedance table, assembly constraints and purchasing terms as the controlling project sources.